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IsoQure® DCD 100 S is a superfine micronized dicyandiamide hardener for the curing of epoxy resins. At room temperatures, IsoQure® DCD 100 SF provides with an almost unlimited shelf life combined with fast curing at elevated temperatures.

IsoQure® DCD 100 S is a latent epoxy resin hardener which provides (in contrary to aliphatic or aromatic amines) with an almost unlimited shelf life of the finished epoxy resin compound. At temperatures starting at about 180°C, IsoQure® DCD 100 S reacts with epoxy resins very fast.

For lower curing temperatures, IsoQure® DCD 100 S is used in combination with adequate uron-catalysts like IsoQure® UR 200, IsoQure® UR 300, IsoQure® 400, IsoQure® 500, or IsoQure® UR 600.

Dicyandiamides like IsoQure® DCD 100 SF are the most widely used epoxy resin hardeners for curing at elevated temperatures. Applications extend from laminates for electrical circuit boards to powder coatings, from structural adhesives to high- tech carbon fibre composites.

IsoQure® DCD 100 SF can also be supplied as a masterbatch in epoxy resin, as a low turbidity crystalline powder, or as a solution.